FOR IMMEDIATE RELEASE
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Messe Düsseldorf North America
150 North Michigan Avenue
Chicago, IL 60601
MESSE DÜSSELORF INDIA COLLABORATES WITH INDIAN INSTITUTE OF PACKAGING FOR NEW PACPROCESS INDIA EVENT
The trade fair organizers Messe Düsseldorf India and the Indian Institute of Packaging (IIP) have agreed to collaborate and starting next year, they will combine their expertise in the packaging sector and the related processing industry with a focus on the Indian market. In October 2017, a combination of the new pacprocess India trade fair and the well established IndiaPack (an event created by IIP) is planned in New Delhi. pacprocess India is a further development of International PackTech India, previously organized with the involvement of Messe Düsseldorf until 2016.
In the future, Messe Düsseldorf and its Indian subsidiary will be responsible for the strategy, conceptual planning and implementation of the trade fairs as well as for the national and international marketing. The events form part of the interpack alliance, consisting of the international events of Messe Düsseldorf in the packaging and processing segment. The trade fairs will be complemented by the International Summit for Packaging Industry (ISPI) organized by IIP.
Starting in 2017, the trade fairs will be held annually, alternating between different cities. After New Delhi in 2017 and Mumbai in 2018, the venue will be Bangalore in 2019. In 2018, drink technology India, organized by Messe München (Munich), will be held concurrently at the Bombay Convention & Exhibition Centre.
“The Indian Institute of Packaging will be a strong partner for us so that we can continue to offer our customers the leading platform for this industry in India. Also for the Indian market we are therefore consistently working on our goal of establishing interpack alliance trade fairs as number-one events in the region,” stated Bernd Jablonowski, Global Portfolio Director Processing & Packaging at Messe Düsseldorf.
About the interpack alliance
The interpack alliance consists of Messe Düsseldorf events within the processing & packaging portfolio. Exhibitors and visitors can recognize the relevant trade fairs by the universal brand logo, which is based on the interpack trade fair, the world’s most important event for the packaging industry and the related processing sector. The interpack alliance includes the flagship trade fair interpack (Düsseldorf) as well as upakovka (Moscow), food pex (Shanghai), bulk pex (Shanghai), pacpro Asia (Shanghai), International Packtech India (until 2016) / FoodPex India (Mumbai), components (Düsseldorf), food processing & packaging exposyum Kenya (Nairobi), indopack (Jakarta) and process expo (Chicago). The Chinese events are combined under the name Shanghai World of Packaging (swop). The interpack alliance targets important growth markets, focusing on food and beverage, confectionery and baked goods, pharmaceuticals, cosmetics, non-food consumer goods and industrial goods – with the relevant emphasis at each event.
About the Indian Institute of Packaging
The Indian Institute of Packaging (IIP) is an autonomous body in the field of packaging and working under the administrative control of the Ministry of Commerce and Industry, Government of India. The Institute was established on May 14, 1966 with its headquarter and principal laboratories in Mumbai. The Institute set up its first branch office at Chennai in 1971, followed by branches at Kolkata, Delhi and Hyderabad in 1976, 1986 and 2006, respectively. The main objective of the Institute is to promote the export market by way of innovative package design and development as well as to upgrade the overall standards of packaging in the country. The Institute is involved in various activities like testing and evaluation of packaging materials and packages, consultant services and research & development related to packaging. In addition, the Institute is involved in training and education in the field of packaging.
For further information on visiting or exhibiting at pacprocess India 2017, contact Messe Düsseldorf North America, 150 North Michigan Avenue, Suite 2920, Chicago, IL 60601. Telephone: (312) 781-5180; Fax: (312) 781-5188; E-mail: firstname.lastname@example.org; Visit our web site http://www.mdna.com; Subscribe to our blog http://blog.mdna.com; Follow us on twitter at http://twitter.com/Packaging_MDNA